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Shenzhen Telionpcb Electronic Co.,LTD  

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You are here: home  > blind-buried hole pcb/Multi-Layer FPC/high-precision impedance/high frequency h-Tg/Al Cu ceramic base PCB

blind-buried hole pcb/Multi-Layer FPC/high-precision impedance/high frequency h-Tg/Al Cu ceramic base PCB 

Payment Terms: T/T,WU 
Place of Origin: Guangdong, China (Mainland) 
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Product Detail

Means of Transport: Ocean,Air
Base Material: FR-4
Board Thickness: 1.6mm
Min. Line Width: 0.15
Number of Layers: 4-Layer
Copper Thickness: 20z
Min. Hole Size: 0.1
Min. Line Spacing: 0.12

Multi-Layer Boards 4-layer board
specifications: FR-4,1.6mm 2.5OZ Green sold mask white slikscreen, Immersion gold
Technology Capability

Multi-Layer Boards  4-layer board

specifications: FR-4,1.6mm 2.5OZ Green sold mask white slikscreen, Immersion gold


Technology Capability

      LAYERS:1-48Layers 

    Materials: FR-4,CEM-3,Rogers,Halogen Free,Hi-TG,etc

    Thickness: 0.2mm-3.0mm

copper thickness: 0.5OZ-6OZ

   Solder Mask: Green,Blue,white,black,yellow,etc

   Silkscreen: white,black

Surface treatment: OSP,(Leadfree)HAL,Gold-plating,Immersion gold/silver,etc

Other Technology:Gold finger, peelable mask, Non-across blind/buried vias, HDI,characteristic impedance control,high-precision impedance,high frequency h-Tg

Pls feel free to contact sales(at)telionpcb dot com

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 Ms. milan

Tel: 86-755-81581472
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Company Info

Shenzhen Telionpcb Electronic Co.,LTD [China (Mainland)]


Business Type:Manufacturer, Trading Company
City: Shenzhen
Province/State: Guangdong
Country/Region: China (Mainland)

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